Samsung signs a $200 billion chip deal with Broadcom covering memory, foundry and advanced packaging through 2030

Samsung Electronics and Broadcom have signed a memorandum of understanding worth more than $200 billion spanning memory chips, foundry manufacturing and advanced packaging for artificial intelligence semiconductors. The deal, announced on Friday at an AI summit in San Francisco, runs for five years through 2030 and covers some of the most critical layers of the […] This story continues at The Next Web