AI Chiplet Architectures Redefining Test Insertions

Key Summary Lithographic and reticle limits are forcing AI chips into 2.5D/3D chiplet packages, redefining where test must happen. With GPU prices heading toward $28K, “known-good everything”—metrology, ATE, and SLT together—is essential to protect yield. Testing now must happen on unpackaged CoW/CoP modules via C4 bumps, demanding new prober designs.