Shipment spans customers from AI and high-performance computing to mobile, robotics and space technology. SINGAPORE, 2 October 2026 – Silicon Box, a leader in chiplet integration and advanced packaging for semiconductors, has shipped more than 1 billion units from its flagship panel-level packaging factory in Singapore, a tenfold increase since passing 100 million units in October last year. The company projects 2 billion units shipped by end of 2026, reflecting strong capacity demand and bookings across customer segments spanning AI, automotive, space program, robotics, and mobile.
Silicon Box Ships 1 Billion Units, 2 Billion Year-End Production Target
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October 2, 2026
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