Silicon Box Secures SGD 100M Financing to Accelerate Growth in Advanced Packaging

SINGAPORE — 8 June 2026 — Silicon Box , a pioneer in advanced semiconductor panel-level packaging and chiplet integration, today announced that it has secured SGD 100 million in debt financing from leading institutional investors – funds managed by Ares Management Corporation (“ Ares ”), InnoVen Capital , January Capital Growth Credit (“January Capital”) , and Abound Capital . The facility includes an option to upsize by an additional USD 75 million. As traditional monolithic scaling approaches physical and economic limits, Silicon Box’s proprietary SiPlet® technology and panel-level packaging