Henkel ultra-low viscosity Technomelt material delivers rugged protection for challenging electronic device designs

Expanding its award-winning line of Technomelt low pressure molding materials, Henkel today announced the addition of Technomelt PA 6370, a highly flowable, ultra-low melt viscosity formulation engineered for the most intricate and challenging electronic systems and components. Capable of thoroughly filling gaps as small as 0.5mm, the new polyamide-based hot melt meets rigorous industry requirements to ensure rugged moisture, heat, corrosion, and environmental resistance, elevating operational reliability.