ATLANT 3D and Entalpic Partner to Build AI-Driven Digital Twins for ALD Processes​

ATLANT 3D and Entalpic Partner to Build AI-Driven Digital Twins for ALD Processes COPENHAGEN & PARIS, March 24, 2026 ATLANT 3D and Entalpic have announced a collaboration to develop AI models capable of predicting and optimizing Atomic Layer Deposition (ALD) processes using experimental data generated on ATLANT 3D’s Direct Atomic Layer Processing (DALP®) platform. Atomic Layer Deposition is a critical technology for advanced materials engineering, enabling atomic-scale control of thin films used in semiconductors, electronics, energy devices, and next-generation coatings. ATLANT 3D brings a un