Purpose-built for AI Interconnects in Chip-to-Chip and Chip-To-Module applications, Eliyan’s NuLink™-XD 224G SerDes Enables Next-Generation Implementations such as Near-Package Optics, OSFP and XPO Highlights: SANTA CLARA, California – July 24, 2026 – Targeting the growing need for more efficient and scalable electro-optical interconnects, Eliyan, a leader in foundational connectivity technologies enabling next-generation AI […]