Blog Post: Agentic AI for PCB and Advanced Packaging Design

As AI workloads grow, more engineering challenges extend beyond the chip itself to the package that brings compute, memory, power, and cooling together. The HBM4 standard is designed to increase memory bandwidth, while evolving stacking requirements add to the importance of power delivery and thermal management. Co-packaged optics bring optical engines closer to switching or compute ASICs, creating opportunities to support higher-bandwidth interconnects while introducing challenges in signal integrity, mechanical integration, and thermal design.