Ayar Labs and GUC Complete Successful Thermal Co-Simulation Testing of Co-Packaged Optics

The CPO revolution is at our doorstep. But transforming data center interconnects requires overcoming new challenges in architecture, power delivery, mechanical design, and thermal management. Of these, thermal management has emerged as one of the most critical areas for successfully deploying co-packaged optics (CPO) in hyperscale AI environments.