Avicena Announces Modular LightBundle™ Optical Interconnect Platform with > 1Tbps/mm I/O density and < 1pJ/bit

Avicena is unveiling its modular LightBundle interconnect platform with industry-leading power efficiency and density based on microLEDs, aimed at AI scale-up networks San Francisco, CA — March 31, 2025 — Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundleTM interconnect platform at OFC 2025 in San Francisco, CA (https://www.ofcconference.org/en-us/home/). LightBundle supports > 1Tbps/mm […]