Download Elephantech’s New Toyosu Advanced Packaging Center Facility Preparation Underway at Toyosu Advanced Packaging Center Elephantech Inc. (CEO: Shinya Shimizu, Headquarters: Chuo-ku, Tokyo) announces plans to commence operations at its new Toyosu Advanced Packaging Center (Toyosu APC) in March 2027. The facility will support manufacturing scale-up and advanced packaging R&D to meet surging demand for AI servers.
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