Elephantech Joins the 27th International Conference on Electronic Packaging Technology (ICEPT)

Elephantech will participate in the 27th International Conference on Electronic Packaging Technology (ICEPT) in Xi’an, China, and engage with experts and industry professionals across the electronics packaging field at Poster Session B. Event ICEPT 2026, Poster Session B Date & Time August 7, 10:10 AM (CST, UTC+8) Venue Wyndham Grand Xian South (Xi’an, China) Poster Location Area 1, No. 292 At the conference, Elephantech will showcase its advanced SAphire™ family of nano copperpa…