On August 6, 2026(PT), Shinya Shimizu, Founder and CEO of Elephantech, will present at a webinar hosted by the IEEE Electronics Packaging Society (EPS) Santa Clara Valley Chapter, an IEEE chapter dedicated to electronics packaging and assembly technologies. The session will explore one of the major challenges in AI-driven advanced packaging: enabling high-density interconnect architectures. Shimizu will introduce Elephantech’s proprietary Nano Copper Deposition platform and discuss how it achiev…
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